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AI-Ready Infrastructure

Designed for high-density compute.

AI training and high-performance computing place different demands on a data center than conventional enterprise workloads: higher power density per rack, more intensive cooling, and less tolerance for latency or connectivity bottlenecks. GreenDatacenters designs for those demands from the outset, not as a retrofit.

Interior of a data hall: two rows of server racks either side of a central aisle, insulated coolant pipework overhead feeding hoses into the racks, and a timber-finned end wall with daylight beside it
Conceptual vision
AI·01  AI-ready topics

AI-ready topics

What high-density compute requires.

Compute & cooling

  • AI and HPC workloads

    01

    Data halls are designed around the power and cooling profile of AI training and inference and other high-performance computing workloads, not adapted from general-purpose IT specifications.

  • High-density compute

    02

    Rack densities are engineered well above conventional enterprise levels, with power and cooling capacity matched to that density from the technical design stage.

  • Direct-to-chip liquid cooling

    03

    Liquid cooling delivered directly to the chip is designed in where rack density requires it, alongside conventional air cooling for lower-density areas.

  • Heat capture

    04

    Heat generated by high-density compute is captured at the source, ready for recovery and off-take rather than dissipated to the atmosphere.

Power & connectivity

  • Scalable electrical distribution

    01

    Power distribution within each hall is designed to scale with rack density, from the substation through to the rack, without a redesign at each expansion phase.

  • Carrier-neutral connectivity

    02

    Fiber connectivity is designed to be carrier-neutral, giving operators a choice of providers rather than a single fixed route.

  • Diverse fiber-route concepts

    03

    Multiple physical fiber entry routes are planned from the earliest design stage, reducing reliance on any single path into the site.

  • Latency

    04

    Site selection and network design account for the latency requirements relevant to AI and HPC workloads.

Build & operate

  • Modular data halls

    01

    Halls are built in modular units, allowing capacity to be added in phases as demand and validated capacity develop.

  • Phased construction

    02

    Construction proceeds in phases aligned with validated demand, rather than a single fixed build-out committed upfront.

  • Future expansion

    03

    Sites are planned with room and infrastructure capacity for future phases, so expansion does not require renegotiating the fundamentals of the development.

  • Security

    04

    Physical and technical security measures are integrated into the site design, covering perimeter, building access and critical infrastructure.

AI·02  Connectivity

Connectivity

Redundant fiber, from day one.

Carrier-neutral, multi-route fiber connectivity is planned alongside power and cooling in the same technical design, not added once construction is underway.

Open trench beside a new access road holding a bundled duct bank of orange and grey conduits in clean bedding sand, with a data hall facade behind
Conceptual vision
AI·03  Next step

Next step

Discuss a high-density compute location or capacity requirement.